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MAX379CWG+

MAX379CWG+

Manufacturer No:

MAX379CWG+

Description:

IC SWITCH SP4TX2 3.5KOHM 24SOIC

Datasheet:

Datasheet

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MAX379CWG+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 12pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    400ns, 300ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MC8641DTHX1250HE integrated circuit chip belongs to the PowerQUICC? III family of embedded processors offered by NXP Semiconductors. Below are the advantages and application scenarios associated with this chip:Advantages: 1. High Performance: The MC8641DTHX1250HE chip is based on Power Architecture? e500 cores running at a frequency of 1.25 GHz, providing a powerful and fast processing capability. 2. Integration: It integrates various components, including a system-on-chip (SoC) architecture, PowerPC? cores, integrated memory controllers, a floating-point unit, and a wide range of peripherals and I/O interfaces. This integration simplifies system design and reduces the number of external components required. 3. Networking Capability: The chip is designed specifically for networking applications, offering a range of networking interfaces like Gigabit Ethernet ports, USB (Universal Serial Bus), PCI (Peripheral Component Interconnect), etc. This makes it well-suited for networking equipment such as routers, switches, gateways, and wireless access points. 4. Scalability: The chip supports multiple processor cores (up to two e500 cores), enabling scalable designs to meet various performance requirements. 5. Power Efficiency: With advanced power management capabilities, the chip can optimize power consumption based on system load, making it suitable for applications with power constraints.Application Scenarios: 1. Networking Infrastructure: The MC8641DTHX1250HE chip can be used in various networking infrastructure equipment such as routers, switches, and gateways. Its high performance and networking capabilities make it suitable for handling large data packets, routing protocols, and managing network traffic efficiently. 2. Wireless Communication: The chip can be deployed in wireless access points, enabling high-speed wireless connectivity with advanced security features. 3. Industrial Automation: The integration of industrial communication protocols (such as Ethernet/IP, PROFINET, etc.) on the chip makes it suitable for industrial automation applications. It can be used as a controller for industrial machinery and equipment, providing real-time monitoring and control functionalities. 4. Embedded Systems: The MC8641DTHX1250HE chip can be utilized in embedded systems that require high-performance computing, networking, and connectivity capabilities. Applications include digital signage, POS (Point of Sale) terminals, and multimedia devices, among others.Overall, the MC8641DTHX1250HE integrated circuit chip offers high performance, networking functionalities, and integration, making it suitable for various networking, wireless communication, industrial automation, and embedded system applications.
MAX379CWG+ Relevant information