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MAX382CWN+

MAX382CWN+

Manufacturer No:

MAX382CWN+

Description:

IC MUX 8:1 100OHM 18SOIC

Datasheet:

Datasheet

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MAX382CWN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-SOIC
  • Package / Case
    18-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    200pA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 40pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    2.7V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    4Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S050-1FGG896 is an integrated circuit chip from Microsemi, which is now a part of Microchip Technology. This chip belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S050-1FGG896:Advantages: 1. Versatility: The M2S050-1FGG896 is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem (ARM Cortex-M3). This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller, memory, and peripherals, onto a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family emphasizes security features, including secure boot, tamper detection, and secure key storage. These features make the M2S050-1FGG896 suitable for applications that require robust security measures. 4. Low power consumption: The M2S050-1FGG896 is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: With an FPGA fabric and a 100 MHz ARM Cortex-M3 processor, the chip offers high-performance capabilities for demanding applications.Application scenarios: 1. Industrial automation: The M2S050-1FGG896 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. The FPGA fabric allows for custom logic implementation, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): The chip's combination of FPGA and microcontroller makes it suitable for IoT applications. It can be used for edge computing, sensor data aggregation, protocol conversion, and secure communication. 3. Aerospace and defense: The M2S050-1FGG896's security features and high-performance capabilities make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's low power consumption, security features, and programmability make it suitable for medical devices. It can be used in applications such as patient monitoring, medical imaging, and portable diagnostic equipment. 5. Communications: The M2S050-1FGG896 can be used in communication systems, including wired and wireless networks. It can handle tasks such as protocol conversion, encryption/decryption, and signal processing.These are just a few examples of the advantages and application scenarios of the M2S050-1FGG896 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both FPGA and microcontroller capabilities are required.
MAX382CWN+ Relevant information