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MAX4509CPE+

MAX4509CPE+

Manufacturer No:

MAX4509CPE+

Description:

IC SWITCH SP4T X 2 400OHM 16DIP

Datasheet:

Datasheet

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MAX4509CPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 14pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060T-1FGG676 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S060T-1FGG676 IC chip:Advantages: 1. Versatility: The M2S060T-1FGG676 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S060T-1FGG676, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S060T-1FGG676 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With a combination of FPGA fabric and a powerful ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060T-1FGG676 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization based on specific industrial requirements. 2. Internet of Things (IoT): The chip's low power consumption, security features, and integration make it suitable for IoT applications. It can be used in smart home devices, wearable technology, and other IoT edge devices. 3. Aerospace and defense: The M2S060T-1FGG676 chip's security features, high performance, and reliability make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices. 5. Communications and networking: The M2S060T-1FGG676 chip can be used in networking equipment, routers, switches, and communication protocols. Its FPGA fabric allows for customization and optimization of networking algorithms.These are just a few examples of the advantages and application scenarios of the M2S060T-1FGG676 IC chip. The versatility and features of the chip make it suitable for a wide range of applications in various industries.
MAX4509CPE+ Relevant information