MAX351CPE+

MAX351CPE+

Manufacturer No:

MAX351CPE+

Description:

IC SWITCH SPST-NCX4 35OHM 16DIP

Datasheet:

Datasheet

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MAX351CPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1CG-2SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU1CG-2SFVC784E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, making it suitable for applications that require significant computational power. 3. Programmable logic: The FPGA fabric in the chip allows for hardware acceleration, customization, and real-time processing. It can be programmed to implement custom logic functions, interfaces, and algorithms, enabling efficient and optimized system designs. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components and simplifying system integration. 5. Low power consumption: The XCZU1CG-2SFVC784E is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application scenarios: 1. Embedded systems: The XCZU1CG-2SFVC784E is commonly used in embedded systems that require a combination of high-performance processing and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's FPGA fabric can be used to implement signal processing algorithms and radio interfaces, making it suitable for SDR applications. 3. High-performance computing: The powerful ARM Cortex-A53 cores combined with the FPGA fabric make the XCZU1CG-2SFVC784E suitable for high-performance computing applications that require both processing power and hardware acceleration. 4. Video and image processing: The chip's FPGA fabric can be used to implement real-time video and image processing algorithms, making it suitable for applications such as video surveillance, medical imaging, and computer vision. 5. Networking and communication: The integrated peripherals and programmable logic make the XCZU1CG-2SFVC784E suitable for networking and communication applications, including routers, switches, and network interface cards.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices of a particular system.