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MAX337CUI+

MAX337CUI+

Manufacturer No:

MAX337CUI+

Description:

IC MUX DUAL 8:1 400OHM 28TSSOP

Datasheet:

Datasheet

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MAX337CUI+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-TSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -86dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    20pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 20pF
  • Charge Injection
    3.5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 20V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU9EG-2FFVC900E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High Performance: The XCZU9EG-2FFVC900E chip provides high processing power and performance capabilities, making it suitable for demanding applications. 2. Versatility: It combines a processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA), allowing for flexible and customizable designs. 3. Integration: The chip integrates various components, including processors, memory, and programmable logic, reducing the need for external components and simplifying system design. 4. Power Efficiency: It incorporates power management features to optimize power consumption, making it suitable for power-constrained applications. 5. Scalability: The XCZU9EG-2FFVC900E chip offers scalability, allowing for designs to be easily upgraded or expanded as per requirements.Application Scenarios: 1. Embedded Systems: The XCZU9EG-2FFVC900E chip is commonly used in embedded systems where high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-Performance Computing: Due to its processing power and FPGA capabilities, the chip finds applications in high-performance computing systems, including data centers, cloud computing, and scientific research. 3. Video and Image Processing: The XCZU9EG-2FFVC900E chip's FPGA can be utilized for real-time video and image processing tasks, such as video analytics, computer vision, and image recognition. 4. Wireless Communication: It can be used in wireless communication systems, including base stations, software-defined radios, and wireless infrastructure, where high-speed processing and programmable logic are required. 5. Aerospace and Defense: The chip's performance, integration, and flexibility make it suitable for aerospace and defense applications, including radar systems, avionics, and military communication systems.These are just a few examples, and the XCZU9EG-2FFVC900E chip can be applied in various other domains where its features and capabilities align with the specific requirements of the application.
MAX337CUI+ Relevant information