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MAX4709ESE+

MAX4709ESE+

Manufacturer No:

MAX4709ESE+

Description:

IC MUX 4:1 400OHM 16SOIC

Datasheet:

Datasheet

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MAX4709ESE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 19pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090TS-FG484I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-FG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S090TS-FG484I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S090TS-FG484I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices that require both hardware flexibility and software programmability. It can handle sensor data processing, communication protocols, and security features. 3. Aerospace and defense: The M2S090TS-FG484I chip's security features, high performance, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications: The M2S090TS-FG484I chip can be used in communication systems that require high-speed data processing, encryption, and security features. It can handle tasks like protocol conversion, data encryption, or network interface customization.These are just a few examples of the advantages and application scenarios of the M2S090TS-FG484I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
MAX4709ESE+ Relevant information