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MAX4760ETX+

MAX4760ETX+

Manufacturer No:

MAX4760ETX+

Description:

IC SWITCH DPDT X 4 3.5OHM 36TQFN

Datasheet:

Datasheet

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MAX4760ETX+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    36-TQFN (6x6)
  • Package / Case
    36-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -95dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    25pF
  • Charge Injection
    15pC
  • -3db Bandwidth
    150MHz
  • Switch Time (Ton, Toff) (Max)
    140ns, 50ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    200mOhm
  • On-State Resistance (Max)
    3.5Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:2
  • Switch Circuit
    DPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU3CG-2UBVA530E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-2UBVA530E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functions or algorithms. This flexibility makes it suitable for a wide range of applications, as it can be tailored to meet specific requirements.3. Integrated peripherals: The XCZU3CG-2UBVA530E chip includes various integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It includes power management features that allow for dynamic power scaling and optimization.Application scenarios: 1. Embedded systems: The XCZU3CG-2UBVA530E chip is commonly used in embedded systems where high-performance processing and flexibility are required. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its combination of processing power and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time processing and analysis of data at the edge of the network, reducing latency and improving overall system performance.3. High-performance computing: The XCZU3CG-2UBVA530E chip can be used in high-performance computing applications that require both general-purpose processing and customizable acceleration. It can be used in areas such as scientific research, data analytics, and machine learning.4. Communication systems: The chip's integrated peripherals and processing capabilities make it suitable for communication systems. It can be used in applications such as wireless base stations, network switches, and routers.Overall, the XCZU3CG-2UBVA530E chip offers a combination of processing power, flexibility, and integrated peripherals, making it suitable for a wide range of applications in various industries.
MAX4760ETX+ Relevant information