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MAX4581LESE+

MAX4581LESE+

Manufacturer No:

MAX4581LESE+

Description:

IC MUX 8:1 80OHM 16SOIC

Datasheet:

Datasheet

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MAX4581LESE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -96dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 18pF
  • Charge Injection
    0.5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 100ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    80Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060TS-FGG676I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-FGG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S060TS-FGG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060TS-FGG676I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S060TS-FGG676I chip suitable for aerospace and defense applications that require secure boot, data protection, and tamper detection. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Communications: The M2S060TS-FGG676I chip can be used in communication systems for tasks like protocol conversion, signal processing, and encryption/decryption.These are just a few examples, and the versatility of the M2S060TS-FGG676I chip allows it to be used in various other applications where a combination of FPGA and microcontroller capabilities is required.
MAX4581LESE+ Relevant information