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MAX4582CSE+

MAX4582CSE+

Manufacturer No:

MAX4582CSE+

Description:

IC SWITCH SP4T X 2 80OHM 16SOIC

Datasheet:

Datasheet

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MAX4582CSE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -96dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 10pF
  • Charge Injection
    0.5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    80Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060TS-1FGG676 is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-1FGG676 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components like FPGA fabric, processor, memory, and peripherals on a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S060TS-1FGG676 chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor combination provides high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060TS-1FGG676 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the processor core handles higher-level control tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip can be used in IoT devices for edge computing, data processing, and secure communication. 3. Aerospace and defense: The M2S060TS-1FGG676 chip's combination of FPGA fabric and processor core makes it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, communication systems, and encryption. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Communications: The M2S060TS-1FGG676 chip can be used in communication systems for tasks like protocol conversion, encryption, and signal processing.These are just a few examples, and the versatility of the chip allows for its application in various other domains where a combination of FPGA and processor capabilities is required.
MAX4582CSE+ Relevant information