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MAX4542EUA+

MAX4542EUA+

Manufacturer No:

MAX4542EUA+

Description:

IC SWITCH SPST-NCX2 60OHM 8UMAX

Datasheet:

Datasheet

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MAX4542EUA+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-uMAX/uSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    100ns, 75ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    800mOhm
  • On-State Resistance (Max)
    60Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z030-2FBG676E is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. These chips combine a dual-core ARM Cortex-A9 processor with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XC7Z030-2FBG676E:Advantages: 1. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 2. Programmable logic: The programmable logic fabric allows for the implementation of custom hardware accelerators, enabling the chip to be tailored to specific application requirements. 3. Low power consumption: The XC7Z030-2FBG676E is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integrated peripherals: The chip includes a wide range of integrated peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, reducing the need for additional external components.Application scenarios: 1. Embedded systems: The XC7Z030-2FBG676E is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. This includes applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's programmable logic can be used to implement custom radio frequency (RF) processing blocks, making it suitable for SDR applications that require flexibility and adaptability. 3. Video processing: The high-performance processing capabilities of the chip, combined with its programmable logic, make it suitable for video processing applications such as video surveillance, video analytics, and video encoding/decoding. 4. Internet of Things (IoT): The XC7Z030-2FBG676E can be used in IoT applications that require both processing power and the ability to interface with various sensors and communication protocols. 5. High-performance computing (HPC): The chip's processing capabilities, combined with its programmable logic, can be utilized in HPC applications that require parallel processing and acceleration of specific algorithms.Overall, the XC7Z030-2FBG676E offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require flexibility, customization, and computational power.
MAX4542EUA+ Relevant information