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AD7506KNZ

AD7506KNZ

Manufacturer No:

AD7506KNZ

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 16:1 450OHM 28DIP

Datasheet:

Datasheet

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Payment:

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AD7506KNZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PDIP
  • Package / Case
    28-DIP (0.600", 15.24mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 40pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    18Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU3CG-2SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-2SFVC784I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU3CG-2SFVC784I chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and various serial interfaces. This simplifies system design and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and efficient power usage.Application scenarios: 1. Embedded systems: The XCZU3CG-2SFVC784I chip is commonly used in embedded systems where high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its combination of processing power and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time processing and implement custom algorithms or neural networks, making it suitable for edge AI applications.3. Communications and networking: The integrated peripherals and high-performance processing capabilities of the chip make it suitable for communications and networking applications. It can be used in routers, switches, and other network equipment.4. Medical devices: The XCZU3CG-2SFVC784I chip's processing power and programmable logic resources make it suitable for medical devices that require real-time processing, signal processing, or custom interfaces.5. Aerospace and defense: The chip's high-performance processing and programmable logic capabilities make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, and other mission-critical applications.Overall, the XCZU3CG-2SFVC784I chip offers a combination of processing power, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization.
AD7506KNZ Relevant information