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MAX389CPN+

MAX389CPN+

Manufacturer No:

MAX389CPN+

Description:

IC SWITCH SP4T X 2 3KOHM 18DIP

Datasheet:

Datasheet

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MAX389CPN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-PDIP
  • Package / Case
    18-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    55pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    300Ohm
  • On-State Resistance (Max)
    3kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150-1FCG1152 is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150-1FCG1152:Advantages: 1. Versatility: The M2S150-1FCG1152 combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150-1FCG1152 suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-1FCG1152 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT applications for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT deployments. 3. Aerospace and defense: The M2S150-1FCG1152 can be used in aerospace and defense applications for tasks such as avionics, communication systems, and secure data processing. The integration of FPGA and microcontroller allows for flexibility and adaptability to changing requirements. 4. Medical devices: The chip can be used in medical devices for tasks such as signal processing, data acquisition, and control systems. The low power consumption and security features are beneficial for medical applications. 5. Communications: The M2S150-1FCG1152 can be used in communication systems for tasks such as protocol conversion, encryption/decryption, and signal processing. The high-performance capabilities and security features make it suitable for demanding communication applications.These are just a few examples of the advantages and application scenarios of the M2S150-1FCG1152. The versatility and integration of the chip make it applicable to various industries and use cases where a combination of FPGA and microcontroller capabilities is required.
MAX389CPN+ Relevant information