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MAX306EQI+

MAX306EQI+

Manufacturer No:

MAX306EQI+

Description:

IC MUX 16:1 100OHM 28PLCC

Datasheet:

Datasheet

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MAX306EQI+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PLCC (11.51x11.51)
  • Package / Case
    28-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 130pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The A2F200M3F-FGG256I is an integrated circuit chip designed by Microsemi (now Microchip Technology). It belongs to the SmartFusion?2 family, which combines FPGA (Field Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller.Advantages: 1. Integration: The A2F200M3F-FGG256I chip combines the capabilities of an FPGA and a microcontroller into a single device. This integration allows for complex mixed-signal system designs with flexible reprogrammability.2. FPGA Flexibility: The FPGA fabric provides reconfigurable logic, allowing users to implement custom digital circuits and designs. This flexibility is advantageous for prototyping, experimenting, and optimizing designs for specific requirements.3. Microcontroller Processing: The Cortex-M3 microcontroller on the chip offers reliable and efficient real-time processing capabilities. It can run software applications, handle I/O operations, and communicate with external devices.4. Security Features: The chip offers a range of security features, including secure boot, hardware data encryption, tamper detection, etc. These features make it suitable for applications requiring secure operations, such as IoT devices or industrial controllers.Application Scenarios: 1. Embedded Systems: The A2F200M3F-FGG256I chip is a suitable choice for various embedded system applications. Its combination of FPGA and microcontroller capabilities can be leveraged to build customized control systems, communication modules, or data acquisition units.2. Industrial Automation: With its robust processing capabilities and FPGA-based flexibility, the chip can be used in industrial automation scenarios. It enables the development of programmable logic controllers (PLCs), motor control systems, sensor interfaces, and more.3. Communications and Networking: The chip's architecture is well-suited for networking applications. It can be used to implement network protocols, handle data routing and encryption, and enable secure communication modules.4. Aerospace and Defense: The A2F200M3F-FGG256I chip's security features, along with its FPGA configurability, make it appropriate for aerospace and defense applications. It can be used in critical systems that demand real-time processing, secure data handling, and resilience against tampering.5. Internet of Things (IoT): The chip's compact design, low power consumption, and security enhancements make it useful for IoT applications. It can be used to develop IoT edge devices, gateways, and processing units that interface with sensors, actuators, and other IoT components.It is important to note that the A2F200M3F-FGG256I chip's usage extends beyond these specific scenarios, as it offers reconfigurable capabilities for a wide range of applications requiring mixed-signal processing, custom digital logic, and secure operations.
MAX306EQI+ Relevant information