DG407EWI+
Manufacturer No:
DG407EWI+
Manufacturer:
Description:
IC MUX DUAL 8:1 100OHM 28SOIC
Datasheet:
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Payment:
In Stock : 85
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DG407EWI+ Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-92dB @ 100kHz
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Current - Leakage (IS(off)) (Max)500pA
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Channel Capacitance (CS(off), CD(off))8pF, 65pF
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Charge Injection2pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)200ns, 150ns
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Voltage - Supply, Dual (V±)±4.5V ~ 20V
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Voltage - Supply, Single (V+)5V ~ 30V
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Channel-to-Channel Matching (ΔRon)1.5Ohm
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On-State Resistance (Max)100Ohm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit8:1
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Switch Circuit-
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PackagingTube
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Product StatusActive
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Series-
The XCZU2CG-L2UBVA530E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU2CG-L2UBVA530E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, making it suitable for applications that require significant computational power. 3. Programmable logic: The integrated FPGA fabric allows for hardware acceleration, customization, and real-time processing, enabling the implementation of complex algorithms and high-speed data processing. 4. Low power consumption: The chip is designed to optimize power efficiency, making it suitable for applications where power consumption is a concern. 5. Rich peripheral interfaces: The XCZU2CG-L2UBVA530E offers a variety of interfaces such as PCIe, USB, Ethernet, and DDR4 memory, enabling easy integration with other devices and systems.Application scenarios: 1. Embedded systems: The XCZU2CG-L2UBVA530E is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's FPGA fabric can be used to implement signal processing algorithms for SDR applications, enabling the reception and transmission of various wireless communication standards. 3. High-performance computing: The powerful ARM cores combined with the FPGA fabric make the XCZU2CG-L2UBVA530E suitable for high-performance computing applications, such as data centers, cloud computing, and scientific research. 4. Video and image processing: The chip's FPGA fabric can be utilized for real-time video and image processing tasks, such as video analytics, computer vision, and machine learning. 5. Networking and communication: The XCZU2CG-L2UBVA530E can be used in networking equipment, routers, and switches, where it can handle high-speed data processing, protocol offloading, and network acceleration.It's important to note that the specific use cases and advantages may vary depending on the requirements and design considerations of each application.
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