Home / Analog Switches, Multiplexers, Demultiplexers / MAX328EPE+/
MAX328EPE+

MAX328EPE+

Manufacturer No:

MAX328EPE+

Description:

IC MUX 8:1 3.5KOHM 16DIP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MAX328EPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10pA
  • Channel Capacitance (CS(off), CD(off))
    1.8pF, 8pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    70Ohm
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU9CG-1FFVC900E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU9CG-1FFVC900E:Advantages: 1. High-performance processing: The XCZU9CG-1FFVC900E chip features a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, and an FPGA fabric. This combination allows for high-performance processing and flexibility in implementing custom hardware accelerators. 2. Programmable logic: The FPGA fabric in the chip enables users to implement custom hardware designs, making it suitable for applications that require high-speed data processing, real-time control, or hardware acceleration. 3. Versatility: The XCZU9CG-1FFVC900E chip supports a wide range of interfaces, including PCIe, Ethernet, USB, HDMI, and more. This versatility makes it suitable for various applications that require connectivity and interface with different peripherals. 4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications that require energy efficiency.Application scenarios: 1. Embedded systems: The XCZU9CG-1FFVC900E chip is commonly used in embedded systems that require high-performance processing and real-time control. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The FPGA fabric in the chip allows for hardware acceleration, making it suitable for applications that require high-performance computing, such as data centers, machine learning, and image processing. 3. Communication systems: The XCZU9CG-1FFVC900E chip's support for various interfaces makes it suitable for communication systems, including wireless base stations, software-defined radios, and network switches. 4. Video and image processing: The chip's high-performance processing capabilities and FPGA fabric make it suitable for video and image processing applications, such as video surveillance, medical imaging, and digital signage.These are just a few examples of the advantages and application scenarios of the XCZU9CG-1FFVC900E chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications in various industries.
MAX328EPE+ Relevant information