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MAX383CSE+

MAX383CSE+

Manufacturer No:

MAX383CSE+

Description:

IC SWITCH SPDT X 2 35OHM 16SOIC

Datasheet:

Datasheet

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MAX383CSE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    200pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150T-FC1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-FC1152 IC chip:Advantages: 1. Versatility: The M2S150T-FC1152 is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem. This allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including a 150K logic element FPGA fabric, a 166 MHz ARM Cortex-M3 processor, programmable analog, and digital peripherals. This integration reduces the need for external components, simplifying the overall system design. 3. Security: The SmartFusion2 family of chips, including the M2S150T-FC1152, offers advanced security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150T-FC1152 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With its FPGA fabric and ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150T-FC1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): The chip's low power consumption and integration of FPGA and microcontroller subsystem make it suitable for IoT applications. It can be used for edge computing, sensor data aggregation, and secure communication. 3. Aerospace and defense: The M2S150T-FC1152 chip's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade embedded systems. 4. Medical devices: The chip's versatility and security features make it suitable for medical device applications. It can be used in devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. 5. Communications: The M2S150T-FC1152 chip can be used in communication systems, including wired and wireless networks. Its FPGA fabric allows for protocol customization, while its microcontroller subsystem can handle data processing and control functions.These are just a few examples of the advantages and application scenarios of the M2S150T-FC1152 IC chip. The actual usage depends on the specific requirements and design considerations of the target application.
MAX383CSE+ Relevant information