MAX4508CPE+

MAX4508CPE+

Manufacturer No:

MAX4508CPE+

Description:

IC MUX 8:1 400OHM 16DIP

Datasheet:

Datasheet

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MAX4508CPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 19pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1CG-L2SBVA484E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU1CG-L2SBVA484E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications that require both processing power and programmable hardware acceleration. 2. High-performance processing: The ARM Cortex-A53 cores provide efficient processing capabilities, making it suitable for applications that require real-time processing, high-speed data processing, and complex algorithms. 3. Programmable logic: The FPGA fabric in the chip allows for hardware customization and acceleration. It can be programmed to implement custom logic, interfaces, and algorithms, providing flexibility and performance optimization. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components and simplifying system design.Application scenarios: 1. Embedded systems: The XCZU1CG-L2SBVA484E is commonly used in embedded systems that require a combination of processing power and hardware acceleration. It can be used in applications like industrial automation, robotics, automotive systems, and aerospace. 2. High-performance computing: The chip's FPGA fabric can be utilized to accelerate computationally intensive tasks, such as image and signal processing, machine learning, and data analytics. 3. Networking and communication: With integrated Ethernet and PCIe interfaces, the chip can be used in networking and communication applications, including routers, switches, and network security appliances. 4. Video and image processing: The high-performance processing capabilities of the ARM cores, combined with the FPGA fabric, make the chip suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices of a particular project.