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MAX355CPE+

MAX355CPE+

Manufacturer No:

MAX355CPE+

Description:

IC SWITCH SP4T X 2 350OHM 16DIP

Datasheet:

Datasheet

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MAX355CPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    1.6pF, 5pF
  • Charge Injection
    80pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    7Ohm
  • On-State Resistance (Max)
    350Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1CG-L1SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It offers a combination of a high-performance processing system and programmable logic, making it suitable for a wide range of applications. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High-performance processing: The XCZU1CG-L1SFVC784I integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an FPGA fabric. This combination allows for high-performance processing capabilities, making it suitable for applications that require both processing power and flexibility.2. Programmable logic: The FPGA fabric in the XCZU1CG-L1SFVC784I provides programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. This flexibility is advantageous for applications that require customization and adaptability.3. Heterogeneous processing: The combination of ARM processors and FPGA fabric enables heterogeneous processing, where tasks can be offloaded to the FPGA for parallel execution, resulting in improved performance and power efficiency.4. High-speed interfaces: The XCZU1CG-L1SFVC784I supports various high-speed interfaces, including PCIe, Ethernet, USB, and DDR4 memory interfaces. These interfaces enable connectivity with external devices and systems, making it suitable for applications that require high-speed data transfer.Application scenarios: 1. Embedded systems: The XCZU1CG-L1SFVC784I is suitable for embedded systems that require high-performance processing, real-time capabilities, and customization. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Software-defined radio (SDR): The XCZU1CG-L1SFVC784I's FPGA fabric can be used to implement signal processing algorithms, making it suitable for SDR applications. It can be used in wireless communication systems, defense applications, and research projects.3. High-performance computing: The XCZU1CG-L1SFVC784I's processing capabilities and FPGA fabric make it suitable for high-performance computing applications. It can be used in areas such as data centers, scientific research, and financial analysis.4. Image and video processing: The XCZU1CG-L1SFVC784I's FPGA fabric can be utilized for implementing image and video processing algorithms, enabling applications such as video surveillance, medical imaging, and computer vision.5. Prototyping and development: The XCZU1CG-L1SFVC784I can be used as a development platform for prototyping and testing new hardware and software designs. Its flexibility and programmability allow for rapid iteration and experimentation.Overall, the XCZU1CG-L1SFVC784I integrated circuit chip offers a combination of high-performance processing, programmable logic, and flexibility, making it suitable for a wide range of applications that require customization, real-time capabilities, and high-performance computing.
MAX355CPE+ Relevant information