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MAX4603CWE+

MAX4603CWE+

Manufacturer No:

MAX4603CWE+

Description:

IC SW SPST-NO/NCX4 2.5OHM 16SOIC

Datasheet:

Datasheet

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MAX4603CWE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -59dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    55pF, 55pF
  • Charge Injection
    120pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 350ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    2.5Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090-FGG676I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-FGG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090-FGG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S090-FGG676I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to meet specific requirements of different industrial applications. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. It can handle sensor data, perform local analytics, and communicate with other devices or cloud services. 3. Aerospace and defense: The security features of the chip make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade equipment that require high reliability and security. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, diagnostic equipment, or implantable devices. It can handle data processing, interface with sensors, and provide secure communication. 5. Automotive: The M2S090-FGG676I chip can be used in automotive applications for tasks such as advanced driver assistance systems (ADAS), infotainment systems, or vehicle control units. Its high performance and integration capabilities enable complex functionalities in automotive electronics.These are just a few examples of the advantages and application scenarios of the M2S090-FGG676I chip. The versatility and flexibility of this chip make it suitable for a wide range of applications across various industries.
MAX4603CWE+ Relevant information