MAX349CPN+

MAX349CPN+

Manufacturer No:

MAX349CPN+

Description:

IC MUX 8:1 100OHM 18DIP

Datasheet:

Datasheet

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MAX349CPN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-PDIP
  • Package / Case
    18-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 2pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    2.7V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    16Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z015-L1CLG485I is a member of Xilinx's Zynq-7000 series of integrated circuit (IC) chips. It combines a dual-core ARM Cortex-A9 processor with Xilinx's programmable logic fabric, providing a powerful and flexible platform for a wide range of applications. Here are some advantages and application scenarios of XC7Z015-L1CLG485I chips:Advantages: 1. Flexibility: The combination of a processor and programmable logic enables flexible hardware and software integration. It allows developers to create customized hardware accelerators, optimize performance, and tailor the system to specific needs.2. Processing power: The dual-core ARM Cortex-A9 processors in the XC7Z015-L1CLG485I offer a significant amount of processing power, providing high-performance computation capabilities for various applications.3. Low power consumption: The Zynq-7000 series chips are designed with an emphasis on low power consumption. They feature power management features to optimize energy efficiency and are suitable for applications with strict power requirements.4. Enhanced system integration: The XC7Z015-L1CLG485I integrates programmable logic with a processing system on the same chip, reducing the need for separate processors and FPGAs. This integration simplifies system design, reduces board space, and decreases overall system cost.5. Scalability and future-proofing: The Zynq-7000 series offers scalability, providing a range of devices with different performance levels and capabilities. This allows developers to choose the right chip for their specific application and ensures compatibility with future upgrades or enhancements.Application scenarios: 1. Embedded systems: XC7Z015-L1CLG485I chips are commonly used in embedded systems that require a combination of processing power and hardware flexibility. This includes applications like industrial automation, robotics, medical devices, and automotive systems.2. Wireless communications: The Zynq-7000 series chips are suitable for wireless communication applications, such as baseband processing, software-defined radios, and wireless infrastructure equipment.3. Video and image processing: The programmable logic fabric in XC7Z015-L1CLG485I chips can be utilized to accelerate video and image processing algorithms, enabling tasks like video encoding, decoding, real-time computer vision, and image analysis.4. Internet of Things (IoT) and edge computing: The integration of processors, programmable logic, and various I/O interfaces makes the Zynq-7000 series chips well-suited for IoT devices and edge computing applications. They can handle data acquisition, sensor fusion, signal processing, and real-time analytics at the edge of the network.5. High-performance computing: The XC7Z015-L1CLG485I chips can be used in high-performance computing applications that require a mix of general-purpose processing and hardware acceleration. This includes areas like finance, scientific simulations, and data analytics.Overall, the XC7Z015-L1CLG485I chips offer a versatile platform that combines the benefits of processors and programmable logic. They are suitable for a wide range of applications that require a balance of processing power, flexibility, and system integration.