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MAX4713EUE+

MAX4713EUE+

Manufacturer No:

MAX4713EUE+

Description:

IC SW SPST-NO/NCX4 25OHM 16TSSOP

Datasheet:

Datasheet

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MAX4713EUE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -87dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    25pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    125ns, 80ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 5.5V
  • Voltage - Supply, Single (V+)
    2.7V ~ 11V
  • Channel-to-Channel Matching (ΔRon)
    200mOhm
  • On-State Resistance (Max)
    25Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150T-1FC1152I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150T-1FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of an embedded microcontroller. 2. Integration: It integrates various components, including FPGA fabric, processor, memory, and peripherals, into a single chip. This reduces the need for external components and simplifies the overall system design. 3. Security: The chip offers advanced security features, such as secure boot, tamper detection, and secure key storage, making it suitable for applications requiring robust security measures. 4. Low power consumption: The M2S150T-1FC1152I chip is designed to be power-efficient, enabling longer battery life and reducing overall power consumption in portable or battery-powered devices. 5. High performance: With a combination of FPGA fabric and an ARM Cortex-M3 processor, the chip can handle complex tasks and high-speed data processing.Application scenarios: 1. Industrial automation: The M2S150T-1FC1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. 2. Internet of Things (IoT): Its low power consumption and integration capabilities make it suitable for IoT applications, including smart home devices, environmental monitoring, and asset tracking. 3. Aerospace and defense: The chip's security features and high-performance capabilities make it suitable for aerospace and defense applications, such as avionics systems, secure communication, and military-grade encryption. 4. Medical devices: The chip can be used in medical devices, such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices, where a combination of processing power and programmable logic is required. 5. Communications: The M2S150T-1FC1152I chip can be utilized in communication systems, including network routers, switches, and wireless base stations, where it can handle data processing, protocol handling, and encryption.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.
MAX4713EUE+ Relevant information