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MAX350EWN+

MAX350EWN+

Manufacturer No:

MAX350EWN+

Description:

IC SWITCH SP4T X 2 100OHM 18SOIC

Datasheet:

Datasheet

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MAX350EWN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-SOIC
  • Package / Case
    18-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 2pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    2.7V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    16Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU3CG-L1SBVA484I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-L1SBVA484I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU3CG-L1SBVA484I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and various serial interfaces. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and efficient power usage.Application scenarios: 1. Embedded systems: The XCZU3CG-L1SBVA484I chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and improving overall system performance.3. High-bandwidth data processing: The chip's integrated peripherals, such as PCIe and Ethernet, make it suitable for applications that require high-bandwidth data processing. This includes areas like data centers, high-performance computing, and network infrastructure.4. Software-defined systems: The XCZU3CG-L1SBVA484I chip's combination of processing cores and programmable logic allows for the implementation of software-defined systems. It can be used in applications such as software-defined radios, software-defined networking, and software-defined storage.Overall, the XCZU3CG-L1SBVA484I chip offers a balance of processing power, programmability, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization.
MAX350EWN+ Relevant information