MAX4525CUB+
Manufacturer No:
MAX4525CUB+
Manufacturer:
Description:
IC SWITCH DPDT X 1 150OHM 10UMAX
Datasheet:
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In Stock : 81
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MAX4525CUB+ Specifications
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TypeParameter
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Supplier Device Package10-uMAX/uSOP
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Package / Case10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Crosstalk-74dB @ 1MHz
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Current - Leakage (IS(off)) (Max)1nA
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Channel Capacitance (CS(off), CD(off))4pF, 6pF
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Charge Injection0.8pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)150ns, 120ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)2V ~ 12V
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Channel-to-Channel Matching (ΔRon)2Ohm
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On-State Resistance (Max)150Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitDPDT
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PackagingTube
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Product StatusActive
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Series-
The PAL16R8A-2ML/883B is a programmable array logic (PAL) integrated circuit chip. Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The PAL16R8A-2ML/883B chip can be programmed to perform specific logic functions, allowing for customization and flexibility in circuit design. 2. Compact size: The chip is small in size, making it suitable for applications where space is limited. 3. Low power consumption: It operates on low power, making it energy-efficient. 4. High reliability: The 883B military-grade version of the chip ensures high reliability and durability, making it suitable for harsh environments.Application scenarios: 1. Digital logic design: The PAL16R8A-2ML/883B chip can be used in various digital logic circuits, such as combinational logic circuits, sequential logic circuits, and arithmetic circuits. 2. Control systems: It can be used in control systems to implement specific logic functions, such as decoding, encoding, and data manipulation. 3. Industrial automation: The chip can be utilized in industrial automation systems for tasks like process control, machine control, and data acquisition. 4. Military and aerospace applications: The 883B military-grade version of the chip makes it suitable for use in military and aerospace applications, where reliability and ruggedness are crucial. 5. Test and measurement equipment: The chip can be employed in test and measurement equipment to perform various logic functions required for signal processing and analysis.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the circuit design.
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