DG212BDY-E3

DG212BDY-E3

Manufacturer No:

DG212BDY-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPST-NOX4 85OHM 16SOIC

Datasheet:

Datasheet

Delivery:

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DG212BDY-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -95dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 22V
  • Voltage - Supply, Single (V+)
    4.5V ~ 25V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1EG-2SBVA484E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It offers a combination of processing system (PS) and programmable logic (PL) in a single chip, providing several advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU1EG-2SBVA484E integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an FPGA fabric. This combination allows for high-performance processing capabilities, making it suitable for applications that require significant computational power.2. Programmable logic flexibility: The FPGA fabric in the XCZU1EG-2SBVA484E provides programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. This flexibility is advantageous for applications that require hardware customization and acceleration.3. Heterogeneous processing: The combination of ARM processors and FPGA fabric enables heterogeneous processing, where tasks can be offloaded to the most suitable processing element. This allows for efficient utilization of resources and improved performance in applications that have diverse computational requirements.4. System integration: The XCZU1EG-2SBVA484E integrates various peripherals and interfaces, including USB, Ethernet, PCIe, DDR memory controllers, and more. This integration simplifies system design and reduces the need for external components, making it suitable for applications that require high levels of integration.Application scenarios: 1. Embedded systems: The XCZU1EG-2SBVA484E is well-suited for embedded systems that require a combination of processing power, real-time capabilities, and hardware customization. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace.2. High-performance computing: The XCZU1EG-2SBVA484E's processing capabilities make it suitable for high-performance computing applications. It can be used in areas like data centers, scientific research, and signal processing, where significant computational power is required.3. Software-defined networking: The XCZU1EG-2SBVA484E's FPGA fabric can be utilized to implement custom networking functions, making it suitable for software-defined networking applications. It can be used in routers, switches, and network appliances to provide flexible and programmable networking capabilities.4. Video and image processing: The XCZU1EG-2SBVA484E's high-performance processing and FPGA fabric can be leveraged for video and image processing applications. It can be used in areas like video surveillance, medical imaging, and multimedia processing, where real-time processing and hardware acceleration are crucial.Overall, the XCZU1EG-2SBVA484E integrated circuit chips offer a combination of processing power, flexibility, and integration, making them suitable for a wide range of applications that require high-performance processing, real-time capabilities, and hardware customization.