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DG445DY-E3

DG445DY-E3

Manufacturer No:

DG445DY-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPST-NOX4 85OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG445DY-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    -1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 210ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1CG-L2SFVA625E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU1CG-L2SFVA625E:Advantages: 1. High-performance processing: The XCZU1CG-L2SFVA625E features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The XCZU1CG-L2SFVA625E includes programmable logic resources, allowing users to implement custom hardware accelerators and interfaces. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The XCZU1CG-L2SFVA625E is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Embedded systems: The XCZU1CG-L2SFVA625E is commonly used in embedded systems that require both high-performance processing and programmable logic. Examples include industrial automation, robotics, and automotive systems.2. Video processing: The integrated GPU and programmable logic resources make the chip suitable for video processing applications. It can be used in video surveillance systems, video conferencing equipment, and digital signage.3. Wireless communication: The XCZU1CG-L2SFVA625E's processing capabilities and integrated peripherals make it suitable for wireless communication applications. It can be used in base stations, software-defined radios, and wireless routers.4. High-performance computing: The chip's processing power and programmable logic resources make it suitable for high-performance computing applications. It can be used in data centers, scientific research, and financial analysis.5. Edge computing: The XCZU1CG-L2SFVA625E's combination of processing power and programmable logic makes it suitable for edge computing applications. It can be used in edge AI inference, real-time analytics, and IoT gateways.These are just a few examples of the advantages and application scenarios of the XCZU1CG-L2SFVA625E. The versatility and flexibility of the chip make it suitable for a wide range of applications across various industries.
DG445DY-E3 Relevant information