CD4097BM

CD4097BM

Manufacturer No:

CD4097BM

Manufacturer:

Texas Instruments

Description:

IC MUX DUAL 8:1 240OHM 24SOIC

Datasheet:

Datasheet

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Payment:

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CD4097BM Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    0.2pF, 35pF
  • Charge Injection
    -
  • -3db Bandwidth
    20MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    240Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Last Time Buy
  • Series
    -
The XCZU19EG-1FFVB1517E is a highly advanced integrated circuit (IC) chip designed by Xilinx. It belongs to the Xilinx UltraScale+ family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High Performance: The XCZU19EG-1FFVB1517E chip provides excellent performance capabilities, making it suitable for demanding applications that require significant computing power. 2. Versatility: This IC chip offers a broad range of functionalities and features, making it adaptable to various application scenarios. 3. Customization: It allows users to configure and customize the chip's functionality through Xilinx's Vivado Design Suite. This flexibility enables tailored solutions for specific use cases. 4. Energy Efficiency: The XCZU19EG-1FFVB1517E chip is designed to minimize power consumption without compromising performance, making it suitable for power-constrained applications. 5. Scalability: It supports scalability, allowing users to build systems with multiple chips and seamlessly integrate them for enhanced performance.Application Scenarios: 1. Datacenters: The high-performance capabilities of the XCZU19EG-1FFVB1517E chip are well-suited for datacenter applications like real-time analytics, machine learning, and data processing. 2. Artificial Intelligence (AI): With its powerful computing capabilities, this chip can be used in AI applications, including deep learning, computer vision, natural language processing, and autonomous systems. 3. Industrial Automation: The XCZU19EG-1FFVB1517E chip can be utilized in industrial automation systems, enabling high-speed control, precise measurement, and advanced signal processing for robotics, manufacturing, and process control. 4. Aerospace and Defense: Its performance and customization options make it ideal for aerospace and defense applications, such as radar systems, signal processing, and surveillance.These are just a few examples of the advantages and application scenarios of XCZU19EG-1FFVB1517E integrated circuit chips. The versatility and high-performance capabilities of this chip make it suitable for a wide range of computationally intensive applications.