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MAX328CWE+

MAX328CWE+

Manufacturer No:

MAX328CWE+

Description:

IC MUX 8:1 3.5KOHM 16SOIC

Datasheet:

Datasheet

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MAX328CWE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10pA
  • Channel Capacitance (CS(off), CD(off))
    1.8pF, 8pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    70Ohm
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU9EG-2FFVB1156E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It combines a high-performance processing system with programmable logic, making it suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU9EG-2FFVB1156E integrated circuit chips:Advantages: 1. High-performance processing: The XCZU9EG-2FFVB1156E chip features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. This flexibility enables optimization for specific application requirements.3. Integrated peripherals: The XCZU9EG-2FFVB1156E chip integrates various peripherals, including USB, Ethernet, PCIe, and DDR memory controllers. This integration simplifies system design and reduces the need for external components.4. Power efficiency: The chip incorporates power management features, such as dynamic voltage and frequency scaling, to optimize power consumption. This makes it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The XCZU9EG-2FFVB1156E chip is commonly used in embedded systems that require both high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Video processing: The integrated GPU and programmable logic resources make the chip suitable for video processing applications. It can be used in video surveillance systems, video conferencing equipment, and digital signage.3. Wireless communication: The XCZU9EG-2FFVB1156E chip's processing power and integrated peripherals make it suitable for wireless communication applications. It can be used in base stations, software-defined radios, and wireless access points.4. High-performance computing: The chip's combination of processing power and programmable logic resources makes it suitable for high-performance computing applications. It can be used in areas such as scientific research, data centers, and cloud computing.Overall, the XCZU9EG-2FFVB1156E integrated circuit chips offer a versatile solution for applications that require a combination of high-performance processing and programmable logic capabilities.
MAX328CWE+ Relevant information