MC74HC4051ADTG

MC74HC4051ADTG

Manufacturer No:

MC74HC4051ADTG

Manufacturer:

onsemi

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC74HC4051ADTG Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    200nA
  • Channel Capacitance (CS(off), CD(off))
    130pF
  • Charge Injection
    -
  • -3db Bandwidth
    80MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    10Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S100T-FCG1152 is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S100T-FCG1152 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family emphasizes security features, including secure boot, tamper detection, and secure key storage. These features make the M2S100T-FCG1152 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S100T-FCG1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's security features, high performance, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices that require customization, real-time processing, and secure operation. It can be used in devices such as patient monitors, diagnostic equipment, or implantable devices. 5. Communications: The chip's FPGA fabric can be utilized for implementing communication protocols, signal processing, or encryption algorithms. It can be used in networking equipment, software-defined radios, or secure communication devices.These are just a few examples, and the M2S100T-FCG1152 chip's versatility allows it to be applied in various other domains where a combination of FPGA and microcontroller capabilities is required.