ADG436BRZ-REEL

ADG436BRZ-REEL

Manufacturer No:

ADG436BRZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDT X 2 12OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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ADG436BRZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    13pF
  • Charge Injection
    10pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    70ns, 60ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±3V ~ 20V
  • Voltage - Supply, Single (V+)
    3V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    12Ohm (Typ)
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060T-1FG676 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S060T-1FG676:Advantages: 1. Versatility: The M2S060T-1FG676 is a highly versatile SoC chip that combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family, including the M2S060T-1FG676, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S060T-1FG676 is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: With a combination of FPGA fabric and a powerful ARM Cortex-M3 processor, the chip offers high-performance capabilities, enabling complex computations and real-time processing.Application Scenarios: 1. Industrial Automation: The M2S060T-1FG676 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): The chip's low power consumption, security features, and integration make it suitable for IoT applications. It can be used in IoT gateways, edge computing devices, or sensor nodes, where it can handle data processing, connectivity, and security functions. 3. Aerospace and Defense: The M2S060T-1FG676's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical Devices: The chip's versatility and security features make it suitable for medical devices that require customization, real-time processing, and data security. It can be used in devices such as patient monitors, medical imaging systems, or implantable devices. 5. Communications: The M2S060T-1FG676 can be used in communication systems, including wired or wireless infrastructure equipment. Its FPGA fabric allows for protocol customization, while the microcontroller subsystem can handle control and management functions.These are just a few examples of the advantages and application scenarios of the M2S060T-1FG676 chip. The actual usage depends on the specific requirements and design considerations of the target application.