ADG5412WBRUZ-REEL7
Manufacturer No:
ADG5412WBRUZ-REEL7
Manufacturer:
Description:
IC SW SPST-NOX4 15OHM 16TSSOP
Datasheet:
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In Stock : 900
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ADG5412WBRUZ-REEL7 Specifications
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TypeParameter
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Supplier Device Package16-TSSOP
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Package / Case16-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-70dB @ 1MHz
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Current - Leakage (IS(off)) (Max)10nA
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Channel Capacitance (CS(off), CD(off))17pF, 17pF
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Charge Injection310pC
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-3db Bandwidth160MHz
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Switch Time (Ton, Toff) (Max)240ns, 170ns
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Voltage - Supply, Dual (V±)±9V ~ 22V
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Voltage - Supply, Single (V+)9V ~ 40V
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Channel-to-Channel Matching (ΔRon)350mOhm
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On-State Resistance (Max)15Ohm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesAutomotive
The XC7Z030-L2FFG676I is a specific model of the Xilinx Zynq-7000 family of integrated circuit (IC) chips. These chips combine a dual-core ARM Cortex-A9 processor with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XC7Z030-L2FFG676I IC chips:Advantages: 1. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 2. Programmable logic: The programmable logic fabric allows users to implement custom hardware accelerators, interfaces, and other specialized functionality, providing flexibility and customization options. 3. Low power consumption: The XC7Z030-L2FFG676I chips are designed to be power-efficient, making them suitable for battery-powered or energy-constrained applications. 4. Integrated peripherals: The chips come with a range of integrated peripherals, including USB, Ethernet, UART, SPI, I2C, and GPIO, simplifying system design and reducing the need for external components. 5. High-speed interfaces: The chips support high-speed interfaces like PCIe, DDR3, and Gigabit Ethernet, enabling connectivity to external devices and systems.Application scenarios: 1. Embedded systems: The XC7Z030-L2FFG676I chips are commonly used in embedded systems, where the combination of processing power and programmable logic allows for the implementation of complex algorithms and real-time processing. 2. Industrial automation: These chips can be used in industrial automation applications, such as robotics, machine vision, and control systems, where high-performance processing and customizable hardware interfaces are required. 3. Automotive electronics: The XC7Z030-L2FFG676I chips find applications in automotive electronics, including advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), where a combination of processing power and programmable logic is needed. 4. Aerospace and defense: These chips are suitable for aerospace and defense applications, such as avionics systems, radar processing, and communication systems, where high-performance processing and customization options are critical. 5. Internet of Things (IoT): The XC7Z030-L2FFG676I chips can be used in IoT devices, enabling edge computing capabilities, sensor data processing, and connectivity to cloud services.It's important to note that the specific application scenarios may vary depending on the requirements and design choices made by the system designers.
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