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ADG811YCPZ-REEL7

ADG811YCPZ-REEL7

Manufacturer No:

ADG811YCPZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NCX4 650MOHM 16LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG811YCPZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-LFCSP-VQ (3x3)
  • Package / Case
    16-VFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    30pF, 35pF
  • Charge Injection
    30pC
  • -3db Bandwidth
    90MHz
  • Switch Time (Ton, Toff) (Max)
    25ns, 5ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    40mOhm
  • On-State Resistance (Max)
    650mOhm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S050TS-FGG896 is an integrated circuit chip from Microsemi, which belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050TS-FGG896 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of an embedded microcontroller. 2. Integration: It integrates various components like FPGA fabric, processor, memory, and peripherals on a single chip, reducing the need for external components and simplifying system design. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage, making it suitable for applications requiring high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: It offers built-in reliability features like single-event upset (SEU) mitigation, error correction codes (ECC), and triple-module redundancy (TMR) for critical applications.Application scenarios: 1. Industrial automation: The M2S050TS-FGG896 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features and reliability of the chip make it suitable for aerospace and defense applications, such as avionics systems, secure communication, and military-grade equipment. 4. Medical devices: The chip can be used in medical devices like patient monitoring systems, imaging equipment, and diagnostic devices, where reliability, security, and low power consumption are crucial. 5. Communications: It can be utilized in communication systems for tasks like protocol conversion, signal processing, and network interface implementation.These are just a few examples, and the versatility of the M2S050TS-FGG896 chip allows it to be applied in various other domains where a combination of programmable logic and microcontroller capabilities is required.
ADG811YCPZ-REEL7 Relevant information