ADG444BRZ-REEL
Manufacturer No:
ADG444BRZ-REEL
Manufacturer:
Description:
IC SWITCH SPST-NCX4 70OHM 16SOIC
Datasheet:
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Payment:
In Stock : 1611
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ADG444BRZ-REEL Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-100dB @ 1MHz
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Current - Leakage (IS(off)) (Max)500pA
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Channel Capacitance (CS(off), CD(off))4pF, 4pF
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Charge Injection1pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)110ns, 60ns
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Voltage - Supply, Dual (V±)±15V
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Voltage - Supply, Single (V+)12V
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Channel-to-Channel Matching (ΔRon)-
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On-State Resistance (Max)70Ohm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NC
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The M2S060-1FGG676I is an integrated circuit chip from Microsemi, which is now a part of Microchip Technology. This chip belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S060-1FGG676I:Advantages: 1. Versatility: The M2S060-1FGG676I is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family, including the M2S060-1FGG676I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require secure and reliable operation. 4. Low power consumption: The M2S060-1FGG676I is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric combined with the ARM Cortex-M3 microcontroller subsystem provides high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060-1FGG676I can be used in industrial automation applications such as motor control, robotics, and machine vision. The FPGA fabric allows for real-time control and customization, while the microcontroller subsystem can handle communication protocols and higher-level processing. 2. Aerospace and defense: The chip's security features, along with its high performance and low power consumption, make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 3. Internet of Things (IoT): The M2S060-1FGG676I can be used in IoT applications that require both hardware flexibility and software programmability. It can be used in smart home devices, industrial IoT gateways, and sensor networks. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices. 5. Automotive: The M2S060-1FGG676I can be used in automotive applications that require real-time processing, customization, and security. It can be used in advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units.These are just a few examples of the advantages and application scenarios of the M2S060-1FGG676I chip. The versatility and features of this chip make it suitable for a wide range of applications across various industries.
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