ADG723BRMZ-REEL

ADG723BRMZ-REEL

Manufacturer No:

ADG723BRMZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NCX2 4OHM 8MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG723BRMZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-MSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -97dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    7pF, 7pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 6ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    4Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU46DR-2FSVH1760E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU46DR-2FSVH1760E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications. 2. Programmable logic: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functionalities. This flexibility makes it suitable for a wide range of applications. 3. Integrated peripherals: The XCZU46DR-2FSVH1760E chip integrates various peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies system design and reduces the need for additional external components. 4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications or battery-powered devices. 5. High-speed interfaces: The XCZU46DR-2FSVH1760E chip supports high-speed interfaces like Gigabit Ethernet, USB 3.0, and PCIe Gen3, enabling fast data transfer rates.Application scenarios: 1. Embedded systems: The XCZU46DR-2FSVH1760E chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its powerful processing capabilities and integrated peripherals, the chip is suitable for edge computing applications. It can perform real-time data processing and analysis at the edge of a network, reducing latency and improving overall system performance. 3. High-bandwidth data processing: The XCZU46DR-2FSVH1760E chip's support for high-speed interfaces makes it suitable for applications that require high-bandwidth data processing, such as video processing, image recognition, and machine learning. 4. Networking and communication: The chip's integrated peripherals, including Ethernet and PCIe controllers, make it suitable for networking and communication applications. It can be used in routers, switches, and other network equipment. 5. Aerospace and defense: The XCZU46DR-2FSVH1760E chip's high-performance processing capabilities and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, radar systems, and military-grade equipment.These are just a few examples of the advantages and application scenarios of the XCZU46DR-2FSVH1760E chip. The versatility and flexibility of the chip make it suitable for a wide range of applications across various industries.