STG5683QTR

STG5683QTR

Manufacturer No:

STG5683QTR

Manufacturer:

STMicroelectronics

Description:

IC SWITCH SPDT X 2 550MOHM 16QFN

Datasheet:

Datasheet

Delivery:

Payment:

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STG5683QTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QFN (2.6x1.8)
  • Package / Case
    16-UFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -60dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    6pF
  • Charge Injection
    46pC
  • -3db Bandwidth
    33MHz
  • Switch Time (Ton, Toff) (Max)
    80ns, 50ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 4.5V
  • Channel-to-Channel Matching (ΔRon)
    15mOhm
  • On-State Resistance (Max)
    550mOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The KMPC8343EZQAGDB is a highly integrated circuit chip designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The KMPC8343EZQAGDB chip is built on a Power Architecture core, providing high processing power and performance. 2. Integrated Features: It integrates various peripherals and interfaces, including Ethernet, USB, UART, I2C, SPI, and more, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Scalability: It offers scalability options, allowing for customization and flexibility in different applications. 5. Security Features: The chip includes security features like secure boot, secure key storage, and encryption, making it suitable for applications requiring data protection.Application Scenarios: 1. Networking Equipment: The KMPC8343EZQAGDB chip is commonly used in networking equipment such as routers, switches, and gateways. Its high performance and integrated networking interfaces make it suitable for these applications. 2. Industrial Automation: The chip's scalability and low power consumption make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), industrial gateways, and other automation systems. 3. Embedded Systems: The KMPC8343EZQAGDB chip can be used in various embedded systems, including digital signage, point-of-sale terminals, and smart appliances. Its integrated features and high performance make it suitable for these applications. 4. Communication Systems: The chip's networking capabilities and security features make it suitable for communication systems such as IP phones, voice-over-IP (VoIP) gateways, and wireless access points. 5. Automotive Electronics: The KMPC8343EZQAGDB chip can be used in automotive electronics applications, including infotainment systems, telematics, and advanced driver-assistance systems (ADAS). Its high performance and security features are beneficial in these scenarios.Overall, the KMPC8343EZQAGDB chip offers a combination of performance, integration, scalability, and security, making it suitable for a wide range of applications in networking, industrial automation, embedded systems, communication, and automotive electronics.