DG403DYZ-T

DG403DYZ-T

Manufacturer No:

DG403DYZ-T

Description:

IC SWITCH SPDT X 2 45OHM 16SOIC

Datasheet:

Datasheet

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DG403DYZ-T Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 17V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU46DR-1FFVH1760I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU46DR-1FFVH1760I:Advantages: 1. High-performance processing: The XCZU46DR-1FFVH1760I features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU46DR-1FFVH1760I includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and various serial interfaces. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow dynamic power scaling based on workload requirements.Application scenarios: 1. Embedded systems: The XCZU46DR-1FFVH1760I is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Video processing: The integrated GPU and programmable logic resources make the chip suitable for video processing applications. It can be used in video surveillance systems, video transcoding, and augmented reality/virtual reality (AR/VR) applications.3. Wireless communication: The chip's processing capabilities and integrated peripherals make it suitable for wireless communication applications. It can be used in base stations, software-defined radios, and wireless network infrastructure.4. High-performance computing: The XCZU46DR-1FFVH1760I can be used in high-performance computing applications that require both processing power and programmable logic resources. It can be used in areas such as scientific research, data centers, and cloud computing.Overall, the XCZU46DR-1FFVH1760I offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require flexibility, performance, and power efficiency.