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NLAS4783BMN1R2G

NLAS4783BMN1R2G

Manufacturer No:

NLAS4783BMN1R2G

Manufacturer:

onsemi

Description:

IC SWITCH SPDT X 3 1OHM 16QFN

Datasheet:

Datasheet

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NLAS4783BMN1R2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QFN (3x3)
  • Package / Case
    16-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -62dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500nA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    50pC
  • -3db Bandwidth
    17MHz
  • Switch Time (Ton, Toff) (Max)
    27ns, 20ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 4.5V
  • Channel-to-Channel Matching (ΔRon)
    400mOhm (Max)
  • On-State Resistance (Max)
    1Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MCIMX6Q4AVT08AC is an integrated circuit chip developed by NXP Semiconductors (formerly Freescale Semiconductor) as part of their i.MX6 series of processors. It is specifically designed for applications that require high-performance processing capabilities. Here are some advantages and application scenarios of this chip:1. Advantages: a. High-performance processing: The MCIMX6Q4AVT08AC chip features a quad-core ARM Cortex-A9 processor, which provides excellent computational power for demanding applications. b. Graphics acceleration: It includes an integrated Vivante GC2000 3D graphics engine, enabling hardware-accelerated graphics rendering and enhanced visual experiences. c. Multimedia capabilities: The chip supports multiple video codecs, audio processing, and imaging technologies, making it suitable for multimedia-intensive applications. d. Connectivity options: It offers various interfaces such as HDMI, USB, Ethernet, PCIe, etc., enabling seamless integration with peripherals and communication interfaces. e. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications where energy efficiency is critical.2. Application scenarios: a. Embedded systems: The MCIMX6Q4AVT08AC chip can be used in various embedded applications, such as industrial automation, robotics, smart home devices, etc., where high processing power and multimedia capabilities are required. b. Infotainment systems: It is suitable for automotive infotainment systems, providing support for advanced multimedia playback, navigation, connectivity, and other entertainment features. c. Single-board computers: The chip can be used as the central processing unit in single-board computers (SBCs) for applications like IoT gateways, digital signage, kiosks, etc., where processing power and connectivity are crucial. d. Medical devices: The chip's high performance and multimedia capabilities make it applicable in medical devices such as ultrasound machines, medical imagers, portable healthcare devices, etc. e. Smart appliances: It can be used in smart appliances like refrigerators, washing machines, etc., where graphical user interfaces, multimedia playback, and connectivity features are desired.These are just a few examples of the advantages and application scenarios of the MCIMX6Q4AVT08AC integrated circuit chip. Its versatility, processing power, and multimedia capabilities make it suitable for a wide range of embedded and multimedia applications.
NLAS4783BMN1R2G Relevant information