Home / Analog Switches, Multiplexers, Demultiplexers / BU4066BCF-E2/
BU4066BCF-E2

BU4066BCF-E2

Manufacturer No:

BU4066BCF-E2

Manufacturer:

Description:

IC SWITCH SPST-NOX4 280OHM 14SOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BU4066BCF-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOP
  • Package / Case
    14-SOIC (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -50dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    300nA
  • Channel Capacitance (CS(off), CD(off))
    10pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    280Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC860SRZQ66D4557 is a specific variant of the MPC860 series integrated circuit chips, which are designed for embedded networking and communications applications. Some of the advantages and application scenarios of the MPC860SRZQ66D4557 chip include:1. Power and Performance: The MPC860SRZQ66D4557 chip offers a high-performance PowerPC architecture with a clock speed of up to 66 MHz. It provides a balance between power efficiency and computational capabilities, making it suitable for various applications.2. Integrated Communication Features: The chip includes integrated communication peripherals such as Ethernet controllers, UARTs, I2C, and SPI interfaces. These features enable networking and communication applications, including routers, switches, industrial control systems, and automotive telematics.3. Embedded System Capabilities: The MPC860SRZQ66D4557 chip offers various built-in features specifically designed for embedded systems. It includes memory controllers, DMA controllers, and various I/O interfaces, facilitating the integration of the chip into compact and efficient embedded applications.4. Real-Time Processing: The MPC860SRZQ66D4557 chip provides real-time processing capabilities, enabling applications that require deterministic response times. This is critical for time-sensitive applications such as industrial automation, robotics, and control systems.5. Industrial Temperature Range: The chip is designed to operate reliably across a wide temperature range, typically -40°C to +85°C. This makes it suitable for applications deployed in harsh environments or outdoor settings, such as automotive, aerospace, and industrial applications.6. Scalability: The MPC860SRZQ66D4557 chip is part of a family of MPC860 series chips, offering different variants with varying features and performance levels. This allows for scalability, where different chip variants can be selected based on the specific requirements of the application.7. Legacy Support: The MPC860 series has a long legacy and is supported by various software development tools, libraries, and operating systems. This simplifies the development and maintenance of applications using the chip, as well as facilitates compatibility with existing software and systems.In summary, the MPC860SRZQ66D4557 integrated circuit chip offers a combination of power, communication features, real-time processing, and industrial-grade reliability. It is suitable for a wide range of embedded networking and communications applications, including routers, switches, industrial control systems, automotive telematics, and various real-time systems.
BU4066BCF-E2 Relevant information