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NX3L1T53GT,115

NX3L1T53GT,115

Manufacturer No:

NX3L1T53GT,115

Manufacturer:

NXP USA Inc.

Description:

IC SWITCH SPDT X 1 750MOHM 8XSON

Datasheet:

Datasheet

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NX3L1T53GT,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON, SOT833-1 (1.95x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    35pF
  • Charge Injection
    15pC
  • -3db Bandwidth
    60MHz
  • Switch Time (Ton, Toff) (Max)
    40ns, 20ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.4V ~ 4.3V
  • Channel-to-Channel Matching (ΔRon)
    20mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC8360ZUAGDG is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8360ZUAGDG features a Power Architecture e300 core running at up to 667 MHz, providing excellent processing power for various applications. 2. Integrated Peripherals: It includes a wide range of integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Security Features: The chip incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring data protection. 4. Power Efficiency: The SoC is designed to be power-efficient, enabling longer battery life in portable devices or reducing power consumption in embedded systems. 5. Scalability: The MPC8360ZUAGDG offers scalability options, allowing it to be used in a variety of applications with different performance and feature requirements.Application Scenarios: 1. Networking Equipment: The integrated Ethernet controllers and high processing power make the MPC8360ZUAGDG suitable for use in routers, switches, gateways, and other networking equipment. 2. Industrial Automation: The chip's robustness, security features, and support for various communication protocols make it ideal for industrial automation applications like programmable logic controllers (PLCs), motor control, and factory automation. 3. Telecommunications: With its high-performance processing capabilities and integrated peripherals, the MPC8360ZUAGDG can be used in telecommunications equipment such as base stations, media gateways, and voice-over-IP (VoIP) systems. 4. Automotive: The chip's power efficiency, security features, and support for automotive communication protocols make it suitable for automotive applications like infotainment systems, telematics, and advanced driver-assistance systems (ADAS). 5. Embedded Systems: The MPC8360ZUAGDG can be used in various embedded systems, including medical devices, consumer electronics, and smart appliances, where a balance of performance, power efficiency, and integrated peripherals is required.Overall, the MPC8360ZUAGDG offers a versatile solution for a wide range of applications, combining high performance, integrated peripherals, security features, and scalability.
NX3L1T53GT,115 Relevant information