Home / Analog Switches, Multiplexers, Demultiplexers / CD74HC4051PWT/
CD74HC4051PWT

CD74HC4051PWT

Manufacturer No:

CD74HC4051PWT

Manufacturer:

Texas Instruments

Description:

IC MUX 8:1 130OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CD74HC4051PWT Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    400nA
  • Channel Capacitance (CS(off), CD(off))
    25pF
  • Charge Injection
    -
  • -3db Bandwidth
    180MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±1V ~ 5V
  • Voltage - Supply, Single (V+)
    2V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    130Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The M2S150-FC1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150-FC1152 IC chip:Advantages: 1. Versatility: The M2S150-FC1152 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150-FC1152, provides built-in security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require secure and reliable operation. 4. Low power consumption: The M2S150-FC1152 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric combined with the ARM Cortex-M3 microcontroller subsystem provides high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-FC1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integrated features, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The M2S150-FC1152 chip's security features make it suitable for aerospace and defense applications that require secure and reliable operation. It can be used in avionics systems, communication systems, and military-grade equipment. 4. Medical devices: The chip's integration and flexibility make it suitable for medical devices such as patient monitoring systems, diagnostic equipment, and portable medical devices. 5. Communications: The M2S150-FC1152 chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption.These are just a few examples of the advantages and application scenarios of the M2S150-FC1152 IC chip. The specific usage depends on the requirements and design considerations of the target application.
CD74HC4051PWT Relevant information