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CD4053BMT

CD4053BMT

Manufacturer No:

CD4053BMT

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDT X 3 240OHM 16SOIC

Datasheet:

Datasheet

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CD4053BMT Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -40dB @ 6MHz
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    0.2pF, 9pF
  • Charge Injection
    -
  • -3db Bandwidth
    30MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±2.5V ~ 9V
  • Voltage - Supply, Single (V+)
    3V ~ 20V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    240Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The XCZU7EV-3FBVB900E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. Versatility: The XCZU7EV-3FBVB900E is a highly versatile chip that combines a processing system (ARM Cortex-A53) with programmable logic (FPGA) in a single device. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 processor in the chip provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 3. Programmable logic: The FPGA fabric in the chip allows for hardware customization and acceleration, enabling the implementation of complex algorithms and custom interfaces. 4. Integrated peripherals: The XCZU7EV-3FBVB900E chip includes various integrated peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components. 5. Low power consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern.Application scenarios: 1. Embedded systems: The XCZU7EV-3FBVB900E chip is commonly used in embedded systems where a combination of processing power and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's processing capabilities make it suitable for high-performance computing applications, including data centers, scientific research, and signal processing. 3. Software-defined networking: The XCZU7EV-3FBVB900E chip can be used in networking equipment to implement software-defined networking (SDN) functionalities, such as packet processing, traffic management, and security. 4. Video and image processing: The chip's FPGA fabric can be utilized for real-time video and image processing tasks, including video encoding/decoding, computer vision, and machine learning. 5. Aerospace and defense: The XCZU7EV-3FBVB900E chip's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, such as radar systems, avionics, and communication systems.These are just a few examples of the advantages and application scenarios of the XCZU7EV-3FBVB900E chip. The specific usage depends on the requirements and needs of the system being developed.
CD4053BMT Relevant information