CD74HC4066PWT

CD74HC4066PWT

Manufacturer No:

CD74HC4066PWT

Manufacturer:

Texas Instruments

Description:

IC SW SPST-NOX4 70OHM 14TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CD74HC4066PWT Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -72dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    -
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 10V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    70Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The LX2160SC71826B is a specific model of integrated circuit (IC) chip developed by NXP Semiconductors. It belongs to the Layerscape family of multicore processors and is designed for high-performance networking and data center applications. Here are some advantages and application scenarios of the LX2160SC71826B IC chips:Advantages: 1. High Performance: The LX2160SC71826B features 16 ARM Cortex-A72 cores, each capable of running at up to 2.2 GHz. This provides significant processing power for demanding applications. 2. Networking Capabilities: The chip includes integrated Ethernet interfaces, supporting up to 100 Gigabit Ethernet speeds. It also supports various networking protocols, making it suitable for networking equipment and applications. 3. Scalability: The Layerscape family of processors, including the LX2160SC71826B, is designed to be scalable. This means that it can be used in a range of applications, from small-scale systems to large-scale data centers, allowing for flexibility and future expansion. 4. Power Efficiency: The LX2160SC71826B is designed to be power-efficient, helping to reduce energy consumption and operating costs in applications where power efficiency is crucial.Application Scenarios: 1. Networking Equipment: The LX2160SC71826B is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance cores and networking capabilities make it suitable for handling large amounts of network traffic. 2. Data Centers: With its high processing power and scalability, the LX2160SC71826B is well-suited for data center applications. It can be used in servers, storage systems, and other infrastructure components to handle compute-intensive tasks and manage network traffic efficiently. 3. Edge Computing: The chip's power efficiency and networking capabilities make it suitable for edge computing applications. Edge devices, such as IoT gateways or edge servers, can benefit from the LX2160SC71826B's processing power and ability to handle network traffic at the edge of the network. 4. Network Function Virtualization (NFV): The LX2160SC71826B can be used in NFV deployments, where network functions are virtualized and run on standard hardware. Its high-performance cores and networking capabilities enable efficient execution of virtualized network functions.Overall, the LX2160SC71826B IC chips offer high performance, networking capabilities, scalability, and power efficiency, making them suitable for a range of networking, data center, edge computing, and NFV applications.