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ADG1612BRUZ

ADG1612BRUZ

Manufacturer No:

ADG1612BRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX4 1.1OHM 16TSSOP

Datasheet:

Datasheet

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ADG1612BRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -110dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    300pA
  • Channel Capacitance (CS(off), CD(off))
    60pF, 60pF
  • Charge Injection
    170pC
  • -3db Bandwidth
    38MHz
  • Switch Time (Ton, Toff) (Max)
    156ns, 87ns
  • Voltage - Supply, Dual (V±)
    ±3.3V ~ 8V
  • Voltage - Supply, Single (V+)
    3.3V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    30mOhm
  • On-State Resistance (Max)
    1.1Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU9EG-1FFVC900E is a powerful integrated circuit chip manufactured by Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High Performance: The XCZU9EG-1FFVC900E chip combines a high-performance quad-core ARM Cortex-A53 processor with a cutting-edge programmable logic fabric. This allows it to deliver excellent processing capabilities and perform complex tasks efficiently.2. Versatility: With its combination of processing power and programmable logic, this chip is highly versatile. It can be customized and reprogrammed for various applications, making it suitable for a wide range of projects.3. Energy Efficiency: The XCZU9EG-1FFVC900E chip incorporates power-efficient architecture, ensuring optimized power consumption and longer battery life. It is suitable for battery-powered or energy-conscious devices.4. Scalability: It offers a scalable architecture, allowing designers to scale their designs based on project requirements. This makes it suitable for both small and large-scale applications.Application Scenarios: 1. Embedded Systems: The XCZU9EG-1FFVC900E chip is commonly used in embedded systems, particularly in applications that require a mix of high-performance processors and hardware acceleration. This includes industrial automation, robotics, automotive systems, and aerospace applications.2. Video and Image Processing: Its powerful processing capabilities make it well-suited for video and image processing applications. It can be used in surveillance systems, video analytics, real-time video encoding, and other applications that involve high-speed data processing.3. Datacenter Acceleration: The chip's programmable logic fabric enables acceleration of complex computations, making it useful in datacenters for tasks like machine learning, data analytics, and cloud computing.4. Wireless Communication: Due to its high performance and scalability, this chip is employed in wireless communication systems, such as 5G base stations and wireless infrastructure. It enables fast processing of data packets and efficient handling of high-speed communication protocols.5. High-Performance Computing: The XCZU9EG-1FFVC900E chip's combination of processing power and programmable logic makes it suitable for high-performance computing tasks. It can be used in areas like scientific research, simulation, and modeling that require intense computational capabilities.Overall, the XCZU9EG-1FFVC900E chip's high performance, versatility, energy efficiency, and scalability make it a valuable choice for a wide range of applications across diverse industries.
ADG1612BRUZ Relevant information