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ADG612YRUZ

ADG612YRUZ

Manufacturer No:

ADG612YRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX4 115OHM 16TSSOP

Datasheet:

Datasheet

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ADG612YRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 10MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    -0.5pC
  • -3db Bandwidth
    680MHz
  • Switch Time (Ton, Toff) (Max)
    65ns, 40ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 5.5V
  • Voltage - Supply, Single (V+)
    2.7V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    115Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S050-FCS325 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050-FCS325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S050-FCS325, provides advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The M2S050-FCS325 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Industrial automation: The M2S050-FCS325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S050-FCS325 chip's security features, low power consumption, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. Its low power consumption is beneficial for battery-powered medical devices. 5. Communications: The M2S050-FCS325 chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption. Its FPGA fabric allows for customization and adaptation to different communication standards.These are just a few examples of the advantages and application scenarios of the M2S050-FCS325 chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
ADG612YRUZ Relevant information