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ADG759BCPZ

ADG759BCPZ

Manufacturer No:

ADG759BCPZ

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SP4TX2 4.5OHM 20LFCSP

Datasheet:

Datasheet

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ADG759BCPZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    13pF, 42pF
  • Charge Injection
    3pC
  • -3db Bandwidth
    55MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 8ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±2.5V
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The M2S100-1FCG1152I is an integrated circuit chip from the Microsemi M2S SmartFusion2 family. It is a system-on-a-chip (SoC) device that combines an FPGA fabric with a hard ARM Cortex-M3 processor core. Some of the advantages and application scenarios of this chip include:1. Flexibility and customization: The FPGA fabric allows for the implementation of custom digital logic circuits to meet specific application requirements. It provides the flexibility to handle a wide range of functions and protocols, making it suitable for various applications.2. Integration of processor and FPGA: The presence of the ARM Cortex-M3 processor core on the same chip as the FPGA fabric enables seamless integration of software and hardware components. This integration allows for the processing of complex algorithms in software while offloading resource-intensive tasks to the FPGA fabric, achieving high performance and efficient implementation.3. High processing power: The powerful ARM Cortex-M3 processor core provides high processing power for running real-time operating systems and executing complex algorithms. This makes it suitable for applications that require advanced computational capabilities, such as industrial automation, medical devices, and aerospace systems.4. Enhanced security: The M2S100-1FCG1152I chip features hardware security features designed to protect sensitive information and prevent unauthorized access. These security features include secure boot, secure key storage, tamper detection, and secure debug interfaces. This makes it suitable for applications requiring high levels of data security, such as military systems, financial transactions, and secure communication networks.5. Industrial-grade reliability: The M2S100-1FCG1152I chip is designed to meet industrial-grade reliability standards, making it suitable for deployment in harsh environments with temperature fluctuations, electromagnetic interference, and mechanical vibrations. It is commonly used in industrial automation, control systems, and critical infrastructure applications.Overall, the M2S100-1FCG1152I integrated circuit chip is versatile and well-suited for a wide range of applications where a combination of FPGA flexibility, processing power, and security features is required.
ADG759BCPZ Relevant information