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DG526CY

DG526CY

Manufacturer No:

DG526CY

Manufacturer:

Harris Corporation

Description:

IC MUX 16:1 450OHM 28SOIC

Datasheet:

Datasheet

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DG526CY Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 65pF
  • Charge Injection
    6pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    700ns (Typ), 400ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±22V
  • Voltage - Supply, Single (V+)
    44V
  • Channel-to-Channel Matching (ΔRon)
    27Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The UPD60802AF1-A11-BND-E2-A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed processing capabilities, making them suitable for applications that require quick data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices. 4. Versatility: These chips can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 5. Reliability: The chips are known for their reliability and stability, ensuring consistent performance over extended periods.Application Scenarios: 1. Consumer Electronics: The chips can be used in various consumer electronic devices such as smartphones, tablets, gaming consoles, and digital cameras, where high performance and low power consumption are crucial. 2. Automotive: These chips can be utilized in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs) to enable efficient data processing and reliable performance. 3. Industrial Automation: The chips can be employed in industrial automation systems for tasks like data acquisition, control, and communication, where high-speed processing and reliability are essential. 4. Internet of Things (IoT): These chips can be integrated into IoT devices, enabling efficient data processing and communication between connected devices. 5. Medical Devices: The chips can be used in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices, where high performance and reliability are critical.Overall, the UPD60802AF1-A11-BND-E2-A integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
DG526CY Relevant information