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DG308ABK

DG308ABK

Manufacturer No:

DG308ABK

Manufacturer:

Harris Corporation

Description:

IC SW SPST-NCX4 100OHM 16CERDIP

Datasheet:

Datasheet

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DG308ABK Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-CERDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 8pF
  • Charge Injection
    -10pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S050T-1FGG484M is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050T-1FGG484M chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and bitstream encryption. This makes the M2S050T-1FGG484M chip suitable for applications that require secure and reliable operation. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S050T-1FGG484M chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for tasks like data processing, protocol conversion, and edge computing. The low power consumption makes it suitable for battery-powered IoT applications. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S050T-1FGG484M chip suitable for aerospace and defense applications that require secure and reliable operation. It can be used in avionics systems, communication systems, and military equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. The FPGA fabric allows for customization and adaptation to specific medical requirements.These are just a few examples of the advantages and application scenarios of the M2S050T-1FGG484M chip. The actual usage depends on the specific requirements and design considerations of the target application.
DG308ABK Relevant information