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DG211CJ

DG211CJ

Manufacturer No:

DG211CJ

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPST-NCX4 175OHM 16DIP

Datasheet:

Datasheet

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DG211CJ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    460ns, 450ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    175Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The 10AS032E2F27I1SG is an integrated circuit chip from Intel's Arria 10 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 10AS032E2F27I1SG chip offers high-performance capabilities with a maximum operating frequency of up to 1.5 GHz. It provides fast processing speeds for various applications. 2. Programmability: Being an FPGA, this chip is highly programmable, allowing users to configure and reconfigure its logic functions according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. High Logic Density: With 32,000 logic elements (LEs), this chip offers a high logic density, enabling the implementation of complex digital circuits and systems. 4. Low Power Consumption: The 10AS032E2F27I1SG chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Rich I/O Interfaces: It provides a variety of I/O interfaces, including high-speed transceivers, LVDS, and general-purpose I/O pins, allowing for easy integration with external devices.Application Scenarios: 1. Communications: The high-performance and programmable nature of this chip make it suitable for various communication applications, such as wireless base stations, network switches, and routers. 2. Video and Image Processing: The 10AS032E2F27I1SG chip's high logic density and processing capabilities make it ideal for video and image processing applications, including video encoding/decoding, image recognition, and computer vision. 3. Industrial Automation: This chip can be used in industrial automation systems for tasks like control and monitoring, data acquisition, and signal processing. 4. Aerospace and Defense: The high-performance and low-power characteristics of this chip make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 5. Internet of Things (IoT): With its programmability and low power consumption, this chip can be used in IoT devices for sensor data processing, edge computing, and connectivity.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's implementation choices.
DG211CJ Relevant information