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MAX4612CSD+

MAX4612CSD+

Manufacturer No:

MAX4612CSD+

Description:

IC SW SPST-NO/NCX4 100OHM 14SOIC

Datasheet:

Datasheet

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MAX4612CSD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    16pF, 16pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    300MHz
  • Switch Time (Ton, Toff) (Max)
    65ns, 28ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MPC850DSLZQ50BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by NXP Semiconductors. This integrated circuit chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MPC850DSLZQ50BU are:Advantages: 1. High Performance: The MPC850DSLZQ50BU chip provides high-performance processing capabilities, making it suitable for demanding applications. 2. Power Efficiency: It is designed to be power-efficient, ensuring optimal energy consumption for extended battery life or reduced power requirements. 3. Integrated Features: The chip integrates various features such as a PowerPC core, memory management unit, communication interfaces, timers, and interrupt controllers, reducing the need for additional components. 4. Scalability: The MPC850DSLZQ50BU chip offers scalability, allowing it to be used in a wide range of applications with varying processing requirements. 5. Reliability: NXP Semiconductors is a reputable semiconductor manufacturer, ensuring the reliability and quality of the chip.Application Scenarios: 1. Networking Equipment: The MPC850DSLZQ50BU chip is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance processing capabilities and integrated communication interfaces make it suitable for handling network traffic efficiently. 2. Industrial Automation: The chip can be applied in industrial automation systems, where it can control and monitor various processes. Its reliability and scalability make it suitable for handling real-time control tasks. 3. Embedded Systems: The MPC850DSLZQ50BU chip can be used in embedded systems, including automotive electronics, medical devices, and consumer electronics. Its power efficiency and integrated features make it suitable for applications where space and power constraints exist. 4. Communication Systems: The chip's integrated communication interfaces, such as Ethernet and serial ports, make it suitable for communication systems like modems, gateways, and telecommunication equipment. 5. Internet of Things (IoT): With its power efficiency and integrated features, the MPC850DSLZQ50BU chip can be used in IoT devices, enabling connectivity and processing capabilities for various IoT applications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the MPC850DSLZQ50BU chip in a particular system.
MAX4612CSD+ Relevant information