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HD3SS3411IRWAT

HD3SS3411IRWAT

Manufacturer No:

HD3SS3411IRWAT

Manufacturer:

Texas Instruments

Description:

IC MUX 2:1 8OHM 14WQFN

Datasheet:

Datasheet

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HD3SS3411IRWAT Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-WQFN (3.5x3.5)
  • Package / Case
    14-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Crosstalk
    -35dB @ 4Ghz
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    7.5GHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm (Max)
  • On-State Resistance (Max)
    8Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    DPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060TS-1VF400 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-1VF400 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S060TS-1VF400 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S060TS-1VF400 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the chip make it suitable for aerospace and defense applications, such as secure communication systems, avionics, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices, including patient monitoring systems, diagnostic equipment, and medical imaging devices. 5. Automotive: The M2S060TS-1VF400 chip can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units.These are just a few examples of the advantages and application scenarios of the M2S060TS-1VF400 chip. Its versatility and integration make it suitable for a wide range of industries and applications where customization, performance, and security are important.
HD3SS3411IRWAT Relevant information