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MAX312EUE+

MAX312EUE+

Manufacturer No:

MAX312EUE+

Description:

IC SW SPST-NCX4 10OHM 16TSSOP

Datasheet:

Datasheet

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MAX312EUE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    15pF, 15pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1EG-1SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It offers a combination of processing system (PS) and programmable logic (PL) in a single chip. Here are some advantages and application scenarios of this integrated circuit (IC) chip:Advantages: 1. High-performance processing: The XCZU1EG-1SFVC784I integrates a quad-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 processor, providing high-performance processing capabilities for various applications. 2. Programmable logic: The PL section of the chip consists of programmable logic cells, which can be customized and programmed to implement specific functions or algorithms. This flexibility allows for hardware acceleration and customization. 3. Versatility: The XCZU1EG-1SFVC784I supports a wide range of interfaces and connectivity options, including PCIe, USB, Ethernet, HDMI, and more. This makes it suitable for various applications requiring connectivity and interface compatibility. 4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications where energy efficiency is crucial. 5. High-speed data processing: With integrated high-speed transceivers, the XCZU1EG-1SFVC784I can handle high-speed data transfer and processing, making it suitable for applications requiring high bandwidth.Application scenarios: 1. Embedded systems: The XCZU1EG-1SFVC784I is commonly used in embedded systems where both processing power and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's processing capabilities and programmable logic make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research. 3. Video and image processing: The XCZU1EG-1SFVC784I can be used in applications that require real-time video and image processing, such as surveillance systems, video analytics, and medical imaging. 4. Communication systems: With its connectivity options and high-speed data processing capabilities, the chip can be used in communication systems, including wireless base stations, network switches, and routers. 5. Aerospace and defense: The XCZU1EG-1SFVC784I is suitable for aerospace and defense applications, including radar systems, avionics, and military communication systems, where high-performance processing and customization are essential.It's important to note that the specific use cases and applications may vary depending on the requirements and configurations of the XCZU1EG-1SFVC784I chip.
MAX312EUE+ Relevant information